Product Brief IntroductionW-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape, these features make the application of this composite with great convenience. The thermal expansion can be adjusted to match with the following material:
- Ceramic materials: , (A-90,A-95,A-99), BeO (B-95, B-99), AIN, etc;Semiconductor materials: Si, GaAs, SiGe, SiC, GaP;Metal Material: Kovar alloy(4J29), 42 alloy;
The quality of our composite is the leader in China, contributed with our strict quality control measures. Our porosity is very low; our surface/volume ratio(measured with BET) is only 50% of similar products of 100 pieces of 5*5*2 mm W80-Cu20 composite). Our products have high hermeticity and can pass the He mass-spectrometer leak test (<<5*-9Pa·/S) Our Tungsten Copper Composite Features:No Fe, Co, Ni, Mn and other elements added as the sintering activator, to maintain a high thermal conductivityExcellent hermeticityCan provide semi-finished or finished (Ni/Au plated) productsPrecision machining and excellent dimensional control, surface finish and flatnessWith close technical support including product design, custom manufacturing, testing and post sale supports. Product PropertiesPhysical Properties of Major Products
| Material |
Wt%
Tungsten Content |
Wt%
Copper Content |
g/
Density at 20ºC |
W/M.K
Thermal conductivity at 25ºC |
(10-6/k)
Coefficient of thermal expansion at 20ºC |
| W90Cu10 |
90+/-1 |
Balance |
17.0 |
180-190 |
6.5 |
| W85Cu15 |
85+/-1 |
Balance |
16.4 |
190-200 |
7.0 |
| W80Cu20 |
80+/-1 |
Balance |
15.6 |
200-210 |
8.3 |
| W75Cu25 |
75+/-1 |
Balance |
14.9 |
220-230 |
9.0 |
| W50Cu50 |
50+/-1 |
Balance |
12.2 |
310-340 |
12.5 |
Application: These composite are used widely used in applications such as optoelecttronics packages,Microwave packages,C Packages,Laser SUB-MOUNTS ETC.
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