Gold Member Since 2011
Audited Supplier
Zhuzhou Kingdon Industrial & Commercial Co., Ltd.

Molybdenum Sheet, Molybdenum Copper Sheet, Mocu manufacturer / supplier in China, offering Mobdenum Copper Sheet- Mocu-CMC-CPC-Molybdenum Copper Rod, Tungsten Carbide Plate/ Tungsten Cemented Carbide/ Tungsten Carbide, Tungsten Heating Element-Tungsten Heating Wire and so on.

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Mobdenum Copper Sheet- Mocu-CMC-CPC-Molybdenum Copper Rod

FOB Price: Get Latest Price
Min. Order: 1 Piece
Production Capacity: 600000PCS/Year
Transport Package: Plywood Box
Payment Terms: L/C, T/T

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Basic Info
  • Model NO.: KD007
  • Material: Compound Semiconductor
  • Package: BGA
  • Application: Temperature Measurement
  • Trademark: ZZKD
  • Manufacturing Technology: Optoelectronic Semiconductor
  • Type: Intrinsic Semiconductor
  • Signal Processing: Analog Digital Composite and Function
  • Surface: Machined
  • Origin: Zhuzhou
Product Description
Product Brief Introduction
Mo-Cu composites is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.
 
  • Product Properties
Physical Properties of Major Products
MaterialWt%
Molybdenum
Content
Wt%
Copper Content
g/
Density at 20ºC
W/M.K
Thermal conductivity at 25ºC
(/k)
Coefficient of thermal expansion at 20ºC
Mo85Cu15851Balance10160-1806.8
Mo80Cu20801Balance9.9170-1907.7
Mo70Cu30701Balance9.8180-2009.1
Mo60Cu40601Balance9.66210-25010.3
Mo50Cu50500.2Balance9.54230-27011.5
 Cu/Mo70Cu/Cu (CPC) is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of thickness in Cu: Mo: Cu is 1:4:1. it has different CTE in X and Y direction, with higher thermal conductivity than that of W (Mo)-Cu & Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components.
 
  • Features of Cu/Mo70Cu/Cu
  • Large sized sheets available ( length up to XXmm, width up to XXmm)
  • More easily to be stamped into components than CMC
  • Very strong interface bonding which can repeatedly resist 850ºC heat shock
  • Higher thermal conductivity and lower cost
 
  • Product Properties
Materialg/
Density at 20ºC
(10-6/k)
Coefficient of thermal expansion at 20ºC
W/M.K
Thermal conductivity at 25ºC
In-planeThru-thicknessIn-planeThru-thickness
1:4:19.47.29.0340300
Typical Application: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mount.
Mobdenum Copper Sheet- Mocu-CMC-CPC-Molybdenum Copper Rod
 
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Ms. Yutao Zhao
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