TUNGSTEN (W)
Products brief introductionOf all metals in pure form, tungsten has the highest meeting point(3410ºC,6192oF),lowest vapor pressure(at temperatures above,650ºC,3000oF) and the highest tensile strength. It is the ideal material for ultra high temperature and high vacuum applications.Tungsten has the lowest coefficient of thermal expansion (CTE) of ant pure metals, its CTE matches well with semiconductor materials, such as, Si, GaN, GaAs,,,and it is stable at high temperature, make it the ideal material for electronic packing and seals.Tungsten has a lower electrical resistivity than other refractory metals, but it will increase with temperature, this property is critical for high temperature furnace applications.Also remarkable is its high density of 19.3 times that of water, Tungsten and its alloys, W-Ni-Cu or W-Ni-Fe has several advantages: high density (17.0-18.5g/), good machinability, high modulus of elasticity and high absorption capacity x-rays and y-rays.Product PropertiesDensity: 19.3 g/Melting Point: 3410ºCCTE (20-2000ºC): 4.67μm.Thermal Conductivity: 167W.m. ApplicationsPure tungsten products are widely used for Furnace parts, Semiconductor Base Plates, Components for Electron Beam Evaporation, Cathodes and Anodes for lon implantation, Tubes/Boats for Sintering of Capacitors, Targets for X-ray Diagnostics, Crucibles, Heating Elements, X-ray Radiation Shielding, Sputtering Targets and Electrodes.Suitable for producing ion implantation partsFor producing electric light source parts,components of electric vacuumFor producing W-boats,heat shield and heat bodies in high temperature furnaceUsed for tungsten sputtering target
| Product Standard: GB/T3875-83 or ASTM B 760-86 (Reapproved 1999) |
| Size: 0.05~50mm(thickness)×50~500mm(width)×100~1500mm(length) |
| Chemical Composition: |
| W Content |
Total Content of Other Elements |
Each Element Content |
| ≥99.95% |
≤0.05% |
≤0.01% |
|
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