• Tungsten Rod
  • Tungsten Rod
  • Tungsten Rod
  • Tungsten Rod
  • Tungsten Rod

Tungsten Rod

Application: Electronics, Industrial
Standard: GB, ASTM
Purity: >99.95%
Alloy: Non-alloy
Shape: Round
Type: Tungsten Bars
Samples:
US$ 5/kg 1 kg(Min.Order)
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Customization:
Gold Member Since 2011

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Basic Info.

Density
19.2cm3
Surface
Ground or Black
Size
Customized
Transport Package
Plywood Boc
Trademark
ZZKD
Origin
Zhuzhou
HS Code
81019910
Production Capacity
100000ton/Year

Product Description

TUNGSTEN (W)
Products brief introduction
 Of all metals in pure form, tungsten has the highest meeting point(3410ºC,6192oF),lowest vapor pressure(at temperatures above,650ºC,3000oF) and the highest tensile strength. It is the ideal material for ultra high temperature and high vacuum applications.
Tungsten has the lowest coefficient of thermal expansion (CTE) of ant pure metals, its CTE matches well with semiconductor materials, such as, Si, GaN, GaAs,, ,and it is stable at high temperature, make it the ideal material for electronic packing and seals.
  Tungsten has a lower electrical resistivity than other refractory metals, but it will increase with temperature, this property is critical for high temperature furnace applications.
  Also remarkable is its high density of 19.3 times that of water, Tungsten and its alloys, W-Ni-Cu or W-Ni-Fe has several advantages: high density (17.0-18.5g/ ), good machinability, high modulus of elasticity and high absorption capacity x-rays and y-rays.

Product Properties
   Density: 19.3 g/ 
  Melting Point: 3410ºC
  CTE (20-2000ºC): 4.67μm. 
   Thermal Conductivity: 167W.m. 

Applications
  Pure tungsten products are widely used for Furnace parts, Semiconductor Base Plates, Components for Electron Beam Evaporation, Cathodes and Anodes for lon implantation, Tubes/Boats for Sintering of Capacitors, Targets for X-ray Diagnostics, Crucibles, Heating Elements, X-ray Radiation Shielding, Sputtering Targets and Electrodes.
TUNGSTEN (W)
Products brief introduction
   Of all metals in pure form, tungsten has the highest meeting point(3410ºC,6192oF),lowest vapor pressure(at temperatures above,650ºC,3000oF) and the highest tensile strength. It is the ideal material for ultra high temperature and high vacuum applications.
  Tungsten has the lowest coefficient of thermal expansion (CTE) of ant pure metals, its CTE matches well with semiconductor materials, such as, Si, GaN, GaAs,, ,and it is stable at high temperature, make it the ideal material for electronic packing and seals.
   Tungsten has a lower electrical resistivity than other refractory metals, but it will increase with temperature, this property is critical for high temperature furnace applications.
  Also remarkable is its high density of 19.3 times that of water, Tungsten and its alloys, W-Ni-Cu or W-Ni-Fe has several advantages: high density (17.0-18.5g/ ), good machinability, high modulus of elasticity and high absorption capacity x-rays and y-rays.


Tungsten Rod
 

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