Mobdenum Copper Sheet- Mocu-CMC-CPC-Molybdenum Copper Rod

• Manufacturing Technology: Optoelectronic Semiconductor
• Material: Compound Semiconductor
• Type: Intrinsic Semiconductor
• Package: BGA
• Signal Processing: Analog Digital Composite and Function
• Application: Temperature Measurement
• Model NO.: KD007
• Surface: Machined
• Transport Package: Plywood Box
• Trademark: ZZKD
• Origin: Zhuzhou
• Production Capacity: 600000PCS/Year

Product Description

Product Brief Introduction
Mo-Cu composites is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.
 Product PropertiesPhysical Properties of Major Products

Material	Wt% Molybdenum Content	Wt% Copper Content	g/ Density at 20ºC	W/M.K Thermal conductivity at 25ºC	(/k) Coefficient of thermal expansion at 20ºC
Mo85Cu15	851	Balance	10	160-180	6.8
Mo80Cu20	801	Balance	9.9	170-190	7.7
Mo70Cu30	701	Balance	9.8	180-200	9.1
Mo60Cu40	601	Balance	9.66	210-250	10.3
Mo50Cu50	500.2	Balance	9.54	230-270	11.5

 Cu/Mo70Cu/Cu (CPC) is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of thickness in Cu: Mo: Cu is 1:4:1. it has different CTE in X and Y direction, with higher thermal conductivity than that of W (Mo)-Cu & Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components.
 Features of Cu/Mo70Cu/CuLarge sized sheets available ( length up to XXmm, width up to XXmm)More easily to be stamped into components than CMCVery strong interface bonding which can repeatedly resist 850ºC heat shockHigher thermal conductivity and lower cost  Product Properties

Material	g/ Density at 20ºC	(10-6/k) Coefficient of thermal expansion at 20ºC		W/M.K Thermal conductivity at 25ºC
		In-plane	Thru-thickness	In-plane	Thru-thickness
1:4:1	9.4	7.2	9.0	340	300

Typical Application: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mount.