Hunan, China
Business Type:
Manufacturer/Factory, Trading Company
Business Range:
Electrical & Electronics, Industrial Equipment & Components, Lights & Lighting, ...
OEM/ODM Service
Sample Available

Molybdenum Sheet, Molybdenum Copper Sheet, Mocu manufacturer / supplier in China, offering Mobdenum Copper Sheet- Mocu-CMC-CPC-Molybdenum Copper Rod, Tungsten Carbide Cemented Strip-Tungsten Carbide, Tungsten Carbide Brazed Tips-Tungsten Carbide and so on.

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Supplier Homepage Products heat sinks of electronic packing Mobdenum Copper Sheet- Mocu-CMC-CPC-Molybdenum Copper Rod

Mobdenum Copper Sheet- Mocu-CMC-CPC-Molybdenum Copper Rod

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Min. Order: 1 Piece
Port: Changsha, China
Production Capacity: 600000PCS/Year
Payment Terms: L/C, T/T
Manufacturing Technology: Optoelectronic Semiconductor
Material: Compound Semiconductor
Type: Intrinsic Semiconductor
Package: BGA
Signal Processing: Analog Digital Composite and Function
Application: Temperature Measurement

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Basic Info

Model NO.: KD007
Surface: Machined
Trademark: ZZKD
Transport Package: Plywood Box
Origin: Zhuzhou

Product Description

Product Brief Introduction
Mo-Cu composites is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.
  • Product Properties
Physical Properties of Major Products
Copper Content
Density at 20ºC
Thermal conductivity at 25ºC
Coefficient of thermal expansion at 20ºC
 Cu/Mo70Cu/Cu (CPC) is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of thickness in Cu: Mo: Cu is 1:4:1. it has different CTE in X and Y direction, with higher thermal conductivity than that of W (Mo)-Cu & Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components.
  • Features of Cu/Mo70Cu/Cu
  • Large sized sheets available ( length up to XXmm, width up to XXmm)
  • More easily to be stamped into components than CMC
  • Very strong interface bonding which can repeatedly resist 850ºC heat shock
  • Higher thermal conductivity and lower cost
  • Product Properties
Density at 20ºC
Coefficient of thermal expansion at 20ºC
Thermal conductivity at 25ºC
Typical Application: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mount.
Mobdenum Copper Sheet- Mocu-CMC-CPC-Molybdenum Copper Rod

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