Tungsten Copper Sheet

• Customization: Available
• Application: Electronics, Industrial, Semiconductor
• Standard: GB, ASTM
• Purity: 60/40,70/30,80/20
• Alloy: Alloy
• Shape: Square
• Type: Tungsten Sheets
• Density: 14.5g/cm3
• Surface: Ground
• Transport Package: Carton, Plywood Box
• Trademark: ZZKD
• Origin: China

Product Description

TUNGSTEN COPPER COMPOSITE (WCu)
Product Brief Introduction

• W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape, these features make the application of this composite with great convenience. The thermal expansion can be adjusted to match with the following material:

1. Ceramic materials: , (A-90,A-95,A-99), BeO (B-95, B-99), AIN, etc;
2. Semiconductor materials: Si, GaAs, SiGe, SiC, GaP;
3. Metal Material: Kovar alloy(4J29), 42 alloy;

 

• The quality of our composite is the leader in China, contributed with our strict quality control measures. Our porosity is very low; our surface/volume ratio(measured with BET) is only 50% of similar products of 100 pieces of 5*5*2 mm W80-Cu20 composite). Our products have high hermeticity and can pass the He mass-spectrometer leak test (<<5*-9Pa·/S)

 

• Our Tungsten Copper Composite Features:

• No Fe, Co, Ni, Mn and other elements added as the sintering activator, to maintain a high thermal conductivity
• Excellent hermeticity
• Can provide semi-finished or finished (Ni/Au plated) products
• Precision machining and excellent dimensional control, surface finish and flatness
• With close technical support including product design, custom manufacturing, testing and post sale supports.

 

• Product Properties

Physical Properties of Major Products

Material	Wt% Tungsten Content	Wt% Copper Content	g/ Density at 20ºC	W/M.K Thermal conductivity at 25ºC	(10-6/k) Coefficient of thermal expansion at 20ºC
W90Cu10	901	Balance	17.0	180-190	6.5
W85Cu15	851	Balance	16.4	190-200	7.0
W80Cu20	801	Balance	15.6	200-210	8.3
W75Cu25	751	Balance	14.9	220-230	9.0
W50Cu50	501	Balance	12.2	310-340	12.5